Electronics Manufacturing
Semiconductor packaging is the process of enclosing of the semiconductor chip or discreet device in the package. The process flow for semiconductor manufacturing is best considered in two sections, the “front-end” and the “back-end” The “front-end” is wafer processing which is performed in a Wafer Fab area…
Thick-film circuits consist of such passive elements as resistors, capacitors, and inductors deposited on wafers or substrates of such dielectric materials as ceramic, glass, quartz and porcelain-coated metal used for many application like automatice ….
Electronics Manufacturing
Semiconductor packaging is the process of enclosing of the semiconductor chip or discreet device in the package. The process flow for semiconductor manufacturing is best considered in two sections, the “front-end” and the “back-end” The “front-end” is wafer processing which is performed in a Wafer Fab area…
Thick-film circuits consist of such passive elements as resistors, capacitors, and inductors deposited on wafers or substrates of such dielectric materials as ceramic, glass, quartz and porcelain-coated metal used for many application like automatice ….
Turnkey Projects
LTCC Multi-Layer Ceramic Laboratory Line’, ‘Stand Alone Screen and Stencil Printer with Via fill accessory set’, ‘Mechanical Via Puncher for LTCC application Stand Alone..
Multilayer Ceramic Components sophisticated Telcome and defence or computer systems. The circuits are formed by a thin layer of conducting material deposited, or “printed,” on the surface of an insulating board known as the substrate. Individual electronic components are placed on the surface.
Turnkey Projects
LTCC Multi-Layer Ceramic Laboratory Line’, ‘Stand Alone Screen and Stencil Printer with Via fill accessory set’, ‘Mechanical Via Puncher for LTCC application Stand Alone..
Multilayer Ceramic Components sophisticated Telcome and defence or computer systems. The circuits are formed by a thin layer of conducting material deposited, or “printed,” on the surface of an insulating board known as the substrate. Individual electronic components are placed on the surface.
Alternative Energy
Fuel cells are electrochemical devices that convert the chemical energy in a fuel directly to electricity and heat; this process does not involve combustion. Several fuels have been evaluated for use in fuel cells, but the current choice is essentially hydrogen or a mixture containing hydrogen..
Alternative Energy
Fuel cells are electrochemical devices that convert the chemical energy in a fuel directly to electricity and heat; this process does not involve combustion. Several fuels have been evaluated for use in fuel cells, but the current choice is essentially hydrogen or a mixture containing hydrogen..
