Microwave Generated Plasma is the Superior Plasma Technology for Microchip Fabrication.

Microwave Plasma creates an etching process, which is very isotropic and behaves very similar to a wet stripping process. The very high electron density and low kinetic ion energy makes this process ideal for removal of polymers while causing very little surface damage

(Manual Loading Version)

The Plasma System GIGAfab Gen2 is designed for process development of flat panel displays. The chamber is loaded manually. The glass plates are easily placed in a flat position on the extractable drawer. Depending on the gas selected, the plasma has various chemical effects on the surface to be treated. The efficient microwave plasma source has no electrodes, ensuring fast and uniform processing of large substrates.

Microwave Plasma System GIGAfab A200/300

The GIGAfab A is a compact, high-performance, automatic Single Wafer Asher. It is designed to serve main stream semiconductor photoresist stripping, esp. hi-dose implanted resist, MEMS-manufacturing and descum applications for wafer sizes up to 300 mm. Strong isotropy and high ash rates at moderate substrate temperatures make it a perfect tool for a wide range of wafer cleaning and stripping applications

Single Wafer Asher with Proprietary Microwave Plasma Source

The Automatic Single Wafer Asher GIGAfab LED is designed to serve fabrication of opto-electronics, MEMS and power devices. It is equipped with a unique microwave plasma source for high uniformity, providing highly productive processing across a wide temperature range. The modular platform can be configured for 100, 150 or 200 mm wafer size with multiple cassette stations and up to three process chamber modules. Each process chamber features a gravity wafer chuck with lift pins for loading and unloading.

ION WAVE 10 BATCH PLASMA SYSTEM

Microwave generates higher density plasma (ions/radicles) and a lower induced bias voltage across the substrate compared to rf plasma. Because of this fact, the ashing rate of photoresist in microwave plasma is expected to be higher and the plasma damage lower. The IoN Wave 10 plasma system is designed for R&D and small scale production applications. PVA TePla is a proven and trusted resource globally for high-quality, reliable, cost-effective and easy to operate gas plasma systems. It offers some of the most advanced and innovative solutions for a wide variety of applications.

The GIGAfab series targets SU-8 Removal, MEMS Fabrication, Wafer Bumping and Flat Panel Display Technology.

These system features:

• Unique planar source geometry.
• Temperature-controlled substrate plate for large area processing.
• (plate: 310 x 310 mm)
• Drawer type unloading / loading.
• Multiple substrates for Descum, Ashing and Surface Conditioning.
• Microwave power: 2000 Watt max.
• Certified Hydrogen gas option available.

The Plasma System GIGA 690 is a state-of-the-art plasma processing equipment. It is a PC-controlled production tool, featuring all options of data communication, and moreover, it is the most versatile plasma cleaning system in the world of chip packaging.

Featuring electrode-free energy feeding and plasma generation, the GIGA 690 system delivers unsurpassed flexibility. This electrode-free power coupling is key to the treatment of substrates in closed, non-slotted magazines in the downstream process.

The plasma system 80 Plus is easy to operate and features same side loading and unloading, in manual and automatic mode. The System software complies to the standards in the semiconductor industry. Due to the very short process time the system can be integrated into fully automated assembly lines.

Configuration IoN:
RF of 13.56 MHz is applied via electrode into the vacuum chamber to allow physical surface treatment via ion bombardment.
Configuration GIGA:
Microwave of 2,45 GHz is applied on top of the vacuum chamber producing a largely extended plasma producing free radicals. Due to the use of micro waves the 80 Plus GIGA delivers fast, low temperature and damage free chemical surface treatment.

Plasma System  IoN 300

RF plasma systems are the most widely used and versatile plasma technology. This plasma technology is applied to abroad spectrum of industrial, semiconductor and medical device applications.
Material surfaces that require cleaning, coating or chemical modification are immersed into the energetic environment of an RF plasma. Although they are subjected to chemically reactive species that are carried to their surfaces by the directional effects of many RF plasma systems.

The IoN 10QPlasma System is a barrel plasma reactor designed for R&D and production applications. The technology is based on the proven reactor designs developed over the course of 50+ years by International Plasma Corporation, Branson IPC, Dionex, Gasonics, Metroline, TePla and finally PVA TePla. PVA TePla is a proven and trusted resource globally for high-quality, reliable, cost-effective and easy to operate Gas Plasma Systems. It offers some of the most advanced and innovative solutions for a wide variety of applications.

The Ion 40QPlasma System is a barrel type plasma reactor. It is designed for batch processing wafers for photoresist strip, descum, nitride etch and other cleaning applications in semiconductor, LED, and MEMS fabrication. The IoN 40Qtechnology is based on proven reactor designs developed by our company over 40years (International Plasma Corporation, Branson IPC, Dionex, Gasonics, Metroline, TePla and finally PVA TePla). Todays IoN 40Q is designed to meet the evolving demands of our customers, emphasizing versatility and control for their surface treatment needs.

The Photoresist Ashing IoN 100-40Q Plasma System is a barrel plasma reactor designed for high volume production applications. The technology is based on the provenreactor designs developed over the course of 50+ years by International Plasma Corporation, Branson ICP, Dionex, Gasonics, Metroline, TePla and finally PVA TePla. IoN 100-40Q uses a larger chassis that provides all the gas and power connections.

The photoresist ashing IoN 100WB-40Q plasma system is designed for R&D and low volume production applications. The technology is based on the proven reactor designs developed over the course of 57 years. This photoresist ashing plasma system was originally designed and manufactured by International Plasma Corporation. Later the technology was aquired by Branson IPC, Dionex, followed by Gasonics, Metroline, TePla and finally PVA TePla. The photoresist ashingIoN100WB-40Q is derived from the IoN 100-40Q, on a smaller chassis which has all the same plasma qualities as that of IoN 100-40Q, except the pump power connection. The IoN 100WB-40Q requires a facilities power outlet for powering the vacuum pump.

The Photoresist Ashing IoN 10V plasma system is a manual load single wafer RF plasmaAshing, RIE and Descum system. This low cost, mid-sized single wafer system isloaded with advanced features and targets the needs of small scale foundries,universities and start-up companies. The Photoresist AshingIoN 10V plasma system is equipped with new, state of the art components and software toprecisely control processing parameters. This technology has been successfullyused for power transistors, analog devices, sensors, optical devices,photonics, MEMS/MOEMS, bio devices, etc. The small footprint of the IoN 10Vrequires minimal laboratory space and provides for simple installation and maintenance. Leveling casters and brakes allow for easy installation and flexibility.

The ILHC (Inline High Capacity PECVD) is a continuous high speed vacuum plasma system. It offers full process control for plasma assisted chemical vapor deposition(PECVD), etching, cleaning and activation in a high production environment.
The ILHC (Inline High Capacity PECVD) was designed to meet high production flow requirements of our customers. It provides fast process treatment times, excellent uniformity and precise thickness control. Its features provide state of the art process control, fail-safe systems with alarms and full data capturing and reporting software.

The IoN 3B plasma system is designed for R&D and low volume production applications. A compact, fully integrated low frequency generated plasma is used in IoN 3B plasma system. Thesmall table top design is specifically intended to meet the evolving demands of customer surface treatment needs at a low cost of ownership. PVA TePla is a proven and trusted resource globally for high-quality, reliable, cost-effective and easy to operate gas plasma systems. It offers some of the most advanced and innovative solutions for a wide variety of applications.

The IoN 30plasma system is designed for R&D and low volume production applications. A compact, fully integrated radio frequency (RF) generated plasma is used in IoN30 plasma system. The small table top design is specifically intended to meet the evolving demands of customer surface treatment needs at a low cost of ownership. PVA TePla is a proven and trusted resource globally for high-quality, reliable, cost-effective and easy to operate gas plasma systems. It offers some of the most advanced and innovative solutions for a wide variety of applications.

The IoN 40 Plasma System is a barrel plasma reactor designed for R&D and production applications. The technology is based on the proven reactor designs developed over the course of50+ years by International Plasma Corporation, Branson IPC, Dionex, Gasonics, Metroline, TePla and finally PVA TePla. PVA TePla is a proven and trusted resource globally for high-quality, reliable, cost-effective and easy to operate Gas Plasma Systems. It offers some of the most advanced and innovative solutions for a wide variety of applications.

The IoN 100 is a barrel plasma reactor designed for R&D and production applications. The technology is based on the proven reactor designs developed over the course of 50+ years by International Plasma Corporation, Branson ICP, Dionex, Gasonics, Metroline, TePla and finally PVA TePla. IoN 100 uses a larger chassis that provides all the gas and power connections.

The IoN 300 is our latest advancement in vacuum plasma technology. Gas plasma is fast becoming the technology of choice for surface modification of materials in the life sciences, electronic and industrial arenas due to its versatility and low impact to our environment. For example, the trend towards miniaturization in medical diagnostics requires precision cleaning, and selective chemical functionalization. Plasma removes organic contamination several orders of magnitude more efficiently than wet chemical processing and can chemically functionalize surfaces at the nano-scale. As a result, plasma is replacing older types of treatments that are no longer practical or economical.

The IoN Tumbler Plasma System is one of our latest advancements in vacuum plasma technology. Gas plasma is fast becoming the technology of choice for surface modification of materials in the life sciences, electronic and industrial arenas due to its versatility and low impact to our environment. For example, the trend towards miniaturization in medical diagnostics requires precision cleaning, and selective chemical functionalization. Plasma removes organic contamination several orders of magnitude more efficiently than wet chemical processing and can chemically functionalize surfaces at the nano-scale. As a result, plasma is replacing older types of treatments that are no longer practical or economical.

IoN 100-40 Gas Plasma Treatment System for Surface Modification The IoN 100-40 Plasma System is our latest advancement in vacuum plasma technology. Gas plasma is fast becoming the technology of choice for surface modification of materials in the life sciences, electronic and industrial arenas due to its versatility and low impact to our environment. For example, the trend towards miniaturization in medical diagnostics requires precision cleaning, and selective chemical functionalization. Plasma removes organic contamination several orders of magnitude more efficiently than wet chemical processing and can chemically functionalize surfaces at the nano-scale. As a result, plasma is replacing older types of treatments that are no longer practical or economical.