Photoresist Ashing IoN 100-40Q Plasma System

The Photoresist AshingIoN 100-40Q Plasma System is a barrel plasma reactor designed for high volume production applications. The technology is based on the provenreactor designs developed over the course of 50+ years by International Plasma Corporation, Branson ICP, Dionex, Gasonics, Metroline, TePla and finally PVATePla. IoN 100-40Q uses a larger chassis that provides all the gas and power connections.

FEATURES INCLUDE:

• Plug and play self installation

• Industrial computer with LCD touch panel and keyboard. Windows based operating system.

• Graphical User Interface (GUI) software complies with CFR Title 21 Part 11 and Semi E95-1101

• Multi-level of user access

• Software

  • Recipe editor for fast and versatile step controls

  • Onboard diagnostic features and alarm logging

  • Remote process monitoring via Ethernet

  • Online web based simulation/training/support

  
  

• Vacuum pump power outlet on the chassis

• Energy saving feature for vacuum pump

TYPICAL APPLICATIONS:

• Photoresist ashing and descum

• Surface cleaning

• Surface activation

IoN 100-40QPlasma System Technical Data

PROCESS CHAMBER

Material: Quartz chamber
Dimensions: 304 mm D x 508 mm L (12”X20”)
Volume: 37 L (1.31 ft3)
Chamber Opening: 289.56 mm (11.4”)
Electrodes: Clam-shell
Number of MFCs: 1
Process Pressure: (0.16 to 2.66) mbar (120 to 2000) mTorr
Base Pressure: 0.07 mbar (50 mTorr)
Pumping Time: 1 min (Pump dependent)
Wafer Sizes: Up to 200 mm (8”) Batch size (Boat):
25 wafers of diameter 200 mm (8”)
50 wafers of diameter 150 mm (6”)
Wafer Loading: Manual
Plasma Source Frequency/power: 13.56 MHz/600 W

MACHINE DIMENSION AND WEIGHT

737 mm W x 1067 mm D x 1981 mm H (29”x42”x78”) 318 kg (701 lb) (Varieswith options)

FACILITIES REQUIREMENTS

Electricity: 208/240 VAC, 3f, 50/60 Hz, 5-wire, 12.8 kW
Process Gas Input Pressure: 2 bar (30 psi)
Purge Gas Input Pressure: 2 bar (30 psi)
Compressed Air Input Pressure: 6 bar (88 psi)

OPTIONS

• Automated quartz boat loading/unloading

• 13.56 MHz/1000 W plasma source

• Secondary plasma

·        Faraday/Etchtunnel

• Additional MFCs/up to additional five gasses

• Endpoint Detection

·        Singlewavelength

·        Spectrographic

• Process pressure control

• Light tower with R/Y/G/Buzzer

• Barcode scanner; RGA; Printer

• Vacuum pumps (Rotary vane, dry)

• Onboard gas generators (H2, N2, O2)

• Wall mounting package

• SECS/GEM interface

SAFETY CERTIFICATION STANDARDS

CEcertified      EN 60204           EN 61326

PERFORMANCE DATA

Uptime: 95%
MTBF: >500 h
MTTR: <2 h

CHASSIS

• Large roll around chassis with leveling feet

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• Self contained footprint featuring all facilities connections including vacuum pump power control