Photoresist Ashing IoN 100WB-40Q

The photoresist ashing IoN 100WB-40Q plasma system is designed for R&D and low volume production applications. The technology is based on the proven reactor designs developed over the course of 57 years. This photoresist ashing plasma system was originally designed and manufactured by International PlasmaCorporation. Later the technology was aquired by Branson IPC, Dionex, followedby Gasonics, Metroline, TePla and finally PVA TePla. The photoresist ashingIoN100WB-40Q is derived from the IoN 100-40Q, on a smaller chassis which has allthe same plasma qualities as that of IoN 100-40Q, except the pump powerconnection. The IoN 100WB-40Q requires a facilities power outlet for poweringthe vacuum pump.

FEATURES INCLUDE:

• Plug and play self installation

• Industrial computer with LCD touch panel and keyboard. Windows based operating system.

• Graphical User Interface (GUI) software complies with CFR Title 21 Part 11 and Semi E95-1101

• Multi-level user access

• Software

  Recipeeditor for fast and versatile step controls

  Onboarddiagnostic features and alarm logging

  Remoteprocess monitoring via Ethernet

  Onlineweb based simulation/training/support

  
  

  TYPICAL APPLICATIONS:

• Photoresist ashing and Descum

• Surface cleaning

• Surface activation

• Parylene removal

  
  

Technical Data

PROCESS CHAMBER

Material: Quartz chamber
Dimension: 304 mm D x 508 mm L (12”x20”)
Volume: 37 L (1.31 ft3)
Chamber Opening: 289.56 mm (11.4”)
Electrodes: Clam-shell
Number of MFCs: 1
Process Pressure: (0.16 to 2.66) mbar
(120 to 2000) mTorr Base Pressure: 0.07 mbar (50 mTorr)
Pumping time: 1 min (Pump dependent) Wafer Sizes: Up to 200 mm (8”)
Batch size (Boat): 25 wafers of diameter 200 mm (8”)
50 wafers of diameter 150 mm (6”)
Wafer Loading: Manual

FACILITIES REQUIREMENTS

Electricity: 208/240 VAC, 1f, 50/60 Hz, 3-wire, 4.8 kW
Process Gas Input Pressure: 2 bar (30 psi)
Purge Gas Input Pressure: 2 bar (30 psi)
Compressed Air Input Pressure: 6 bar (88 psi)

CHASSIS

• Smaller roll around chassis with leveling feet

• Self contained footprint featuring all gas connections and all power connections except the vacuum pump power

PERFORMANCE DATA

Uptime: 95%
MTBF: >500 h
MTTR: <2 h

OPTIONS

• Automated robotic loading/unloading

• 13.56 MHz/1000 W

• Secondary plasma

·       Faraday/Etchtunnel

• Additional MFCs/up to additional five gases

• End point detector

  
  

  Single wave length

 Spectrographic

• Process pressure control

• Light tower with R/Y/G/Buzzer

• Barcode scanner; RGA; Printer

• Vacuum pumps (rotary vane, dry)

• Onboard gas generators (H2, N2, O2)

• Wall mounting package

• SECS/GEM interface

  
  

PLASMA GENERATOR

Frequency/power: 13.56 MHz/600 W

SAFETY CERTIFICATION STANDARD

• CE certified

• EN 60204

• EN 61326

MACHINE DIMENSION AND WEIGHT

737 mm W x 1067 mm D x 1524 mm H (29”x42”x60”)
239 kg (527 lb) (varies with options)