SINGLE WAFERASHING SYSTEM
The Photoresist Ashing IoN 10V plasma system is a manual load single wafer RF plasmaAshing, RIE and Descum system. This low cost, mid-sized single wafer system isloaded with advanced features and targets the needs of small scale foundries,universities and start-up companies. The Photoresist AshingIoN 10V plasma system is equipped with new, state of the art components and software toprecisely control processing parameters. This technology has been successfullyused for power transistors, analog devices, sensors, optical devices,photonics, MEMS/MOEMS, bio devices, etc. The small footprint of the IoN 10Vrequires minimal laboratory space and provides for simple installation and maintenance. Leveling casters and brakes allow for easy installation and flexibility.
Features include:
Small foot print design
Stainless Steel chamber accommodating up to 8” wafers
7” Touch Screen PC Controller with auto and Manual mode operation
User access control for process development and maintenance programming.
Plug and play installation
Pressure Control
Typical application:
Photoresist stripping
Wafer descum
Wafer cleaning prior to wet etching
SU-8 removal
Etching of passivation layers
Reactive IoN Etch (RIE) Configurable
Batch Wafer System
Technical Data
PROCESS CHAMBER
Material Aluminum
Electrode: 9.0” (230mm) Dia.
Dimensions 12.68” (322mm) Dia.x3.15”H (80mm)
Volume 6.51 Liters (.23cu.ft3)
Process Gas Up to 4 gasses, MFC Controlled
Base Pressure .07 mbar (50 mTorr)
Process Pressure .05-1.5 mbar (375-1125 mTorr)
Evacuation Time ~1 minute
