Microwave Plasma System GIGAfab A200/300
The GIGAfab A is a compact, high-performance, automatic Single Wafer
Asher. It is designed to serve main stream semiconductor photoresist
stripping, esp. hi-dose implanted resist, MEMS-manufacturing and descum
applications for wafer sizes up to 300 mm. Strong isotropy and high ash
rates at moderate substrate temperatures make it a perfect tool for a wide
range of wafer cleaning and stripping applications like:
Resist removal and descum in wafer bumping
Sacrificial layer removal of photoresist, polyimide, PMMA etc.
Fast resist ashing after high-dose implant and RIE
300 mm wafer reclaim
Removal of SU-8 epoxy resist
The GIGAfab A is equipped with a unique planar microwave plasma
source, providing high ash rates over a wide temperature range. In
combination with Chemraz-seals, fluorinated process gases can be
applied. The modular platform allows to configure the system for 200 or
300 mm wafers using open cassette as well as FOUP or SMIF load
stations. The wafer chuck with lift pins for loading is thermoelectrically
controlled from RT to 250°C. Additional option is an ATEX-certified
Hydrogen generator, acting as a point-of-use gas supply.
