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GIGAfab Modular

GigFab Modular Plasma System



Single Wafer Asher with Proprietary Microwave Plasma Source


The Automatic Single Wafer Asher GIGAfab LED is designed to serve

fabrication of opto-electronics, MEMS and power devices. It is equipped

with a unique microwave plasma source for high uniformity, providing

highly productive processing across a wide temperature range.

The modular platform can be configured for 100, 150 or 200 mm wafer size

with multiple cassette stations and up to three process chamber modules.

Each process chamber features a gravity wafer chuck with lift pins for

loading and unloading. It is thermoelectrically controlled from 65°C to

250°C. Wafers are loaded and unloaded by an atmospheric robot with dual

arm configuration for highest throughput. A cooling plate allows cool down

of the wafers prior to re-loading into the plastic cassettes. The chamber lid

is easy to open for maintenance access (clam shell opening).


System Performance


Wafer throughput: varying from 30-180 wafer/hour, depending on process

and number of process chamber modules. Temperature range for stripping:

100-250°C Uniformity: +/- 7.5% across 200 mm for Descum




APPLICATIONS:

  • Resist strip and Descum for opto-electronics and MEMS


  • Sacrificial layer removal of, polyimide, PMMA etc.


  • Fast resist ashing after high-dose Implant and RIE


Technical Specifications