Microwave generates higher density plasma (ions/radicles) and a lower
induced bias voltage across the substrate compared to rf plasma. Because
of this fact, the ashing rate of photoresist in microwave plasma is expected
to be higher and the plasma damage lower. The IoN Wave 10 plasma
system is designed for R&D and small scale production applications. PVA
TePla is a proven and trusted resource globally for high-quality, reliable,
cost-effective and easy to operate gas plasma systems. It offers some of
the most advanced and innovative solutions for a wide variety of
applications.
TYPICAL APPLICATIONS
Photoresist Ashing and Descum
SU-8 removal at lower Temperature
Etching of Passivation layers
Device Decapsulation
Surface Cleaning
Surface Activation
Features Include:
Small foot print table top design
Plug and play self installation
Industrial computer with LCD touch panel and keyboard. Windows
based operating system
Graphical User Interface (GUI) software complies with CFR Title 21
Part 11 and Semi E95-1101
Multi-level user access
Software
Recipe editor for fast and versatile step controls
Onboard diagnostic features and alarm logging
Remote process monitoring via Ethernet
Online web based simulation/training/support
Technical Data
PROCESS CHAMBER
Material: Quartz chamber
Dimension: 248 mm D x 244 mm L (9.76” x9.60”)
Volume: 11.76 L (0.42 ft3)
Chamber opening: 241 mm at seal plate
Number of MFCs: 1
Process Pressure: (0.5 to 1.5) mbar
(375 to 1125) mTorr)
Base Pressure: 0.07 mbar (50 mTorr)
Pumping Time: 1 min (Pump dependent)
Wafer Sizes: Up to 200 mm (8”)
Batch size (Boat): 25 wafers of diameter 150 mm (6”)
Batch size (Plate): 1 wafer of diameter 200 mm (8”)
Wafer Loading: Manual
PLASMA GENERATOR
OPTIONS
Step-up transformer (115 VAC to 230 VAC)
Automated robotic loading/unloading
Ceramic chamber and chemical resistant seals
Secondary plasma
Faraday/Etch tunnel
Additional MFCs/up to additional five gasses
Endpoint Detection
Single wavelength
Spectrographic
Recirculation liquid chiller and Temperature controlled plate
Process pressure control
Light tower with R/Y/G/Buzzer
Barcode scanner; RGA; Printer
Gas (H2, N2, O2) generator package
Vacuum pumps (Rotary vane, dry)
SECS/GEM Interface
PERFORMANCE DATA
Uptime: 95%
MTBF: > 500 h
MTTR: < 2 h
