The GIGAfab series targets SU-8 Removal, MEMS Fabrication, Wafer Bumping and Flat Panel Display Technology.
These system features:
Unique planar source geometry.
Temperature-controlled substrate plate for large area processing.
(plate: 310 x 310 mm)
Drawer type unloading / loading.
Multiple substrates for Descum, Ashing and Surface Conditioning.
Microwave power: 2000 Watt max.
Certified Hydrogen gas option available.
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Photoresist Ashing
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